PRODUCT OVERVIEW：

Micro-grain Copper Anode, an electroplated copper anode material with more than 99.94% of typical copper content, has phosphorus content between 250-650ppm. The product is mainly used in PCB manufacturing, surface finishing, photovoltaic industry, etc.. Micro-grain Copper Anode adopts the industry-leading fully automatic cold heading process to form the ball in one step. Through the microcrystallization treatment, Micro-grain Copper Anode with a grain size of less than 50um is formed, and the anode film (Phosphor copper film) performs better, effectively improving the application performance and reducing the unit copper consumption. Experiments have shown that Micro-grain Copper Anode can save more than 3% of the comprehensive copper consumption.

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